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d a t a sh eet product speci?cation supersedes data of november 1991 file under integrated circuits, ic02 1999 aug 11 integrated circuits TSA5055T 2.65 ghz bidirectional i 2 c-bus controlled synthesizer
1999 aug 11 2 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T features complete 2.65 ghz single-chip system low power 5 v, 60 ma i 2 c-bus programming in-lock flag varicap drive disable low radiation 5-level analog to digital converter (adc) address selection for picture-in-picture (pip), dbs tuner, etc. 6 controllable outputs, 4 bidirectional power-down flag available in sot109-1 (so16) package symmetrical or asymmetrical drive. applications satellite tv high if cable tuning systems. general description the TSA5055T is a single-chip pll frequency synthesizer designed for satellite tv tuning systems. it may be used with a symmetrical input (pins 13 and 14) or with an asymmetrical input (pin 13). control data is entered via the i 2 c-bus; five serial bytes are required to address the device, select the oscillator frequency, program the six output ports and set the charge-pump current. four of these ports can also be used as input ports (three general purpose i/o ports, one adc). digital information concerning these ports can be read out of the TSA5055T on the sda line (one status byte) during a read operation. a flag is set when the loop is in-lock and is read during a read operation. the device has one fixed i 2 c-bus address and three programmable addresses, programmed by applying a specific voltage to port 3. the phase comparator operates at 7.8125 khz when a 4 mhz crystal is used. quick reference data ordering information symbol parameter min. typ. max. unit v cc supply voltage 4.5 5 5.5 v i cc supply current - 60 80 ma f rf rf input frequency range 1 - 2.65 ghz v i (rms) input voltage level (rms value) 1 to 1.8 ghz 50 - 300 mv 1.8 to 2.65 ghz 70 - 300 mv f xtal crystal oscillator frequency 3.2 4 4.48 mhz z xtal crystal oscillator impedance (absolute value) 600 1000 -w i o open-collector output current p7, p6, p5 and p4 -- 10 ma output current p3 and p0 - 1 - ma t amb ambient temperature - 20 - +85 c t stg storage temperature - 40 - +150 c type number package name description code TSA5055T so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1
1999 aug 11 3 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... block diagram handbook, full pagewidth 15-bit programmable divider digital phase comparator charge- pump logic latch 3 control data gate 3 ttl level comparators 3-bit adc address selection i 2 c-bus transceiver power down detector 15-bit latch divider ratio divider n = 512 oscillator 4 mhz to cp t1 sda scl q1 q2 rf in1 rf in2 7.8125 khz 7-bit latch port information in-lock detector p0 p3 p4 p5 p6 p7 f ref f div prescaler 16 pd ud TSA5055T mbc307 os 13 14 2 3 5 4 12 15 1 16 10 11 9 8 7 6 gnd v cc fig.1 block diagram.
1999 aug 11 4 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T pinning symbol pin description pd 1 charge-pump output q1 2 crystal oscillator input 1 q2 3 crystal oscillator input 2 sda 4 serial data input/output scl 5 serial clock input p7 6 port output/input (general purpose) p6 7 port output/input (adc) p5 8 port output/input (general purpose) p4 9 port output/input (general purpose) p3 10 port output (also used for address selection) p0 11 port output v cc 12 voltage supply rf in1 13 rf signal input 1 rf in2 14 rf signal input 2 (decoupled) gnd 15 ground ud 16 drive output fig.2 pin configuration. handbook, halfpage 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 TSA5055T pd q1 q2 sda scl p7 p6 p5 ud gnd rf in2 rf in1 v cc p0 p3 p4 mbc304 functional description general the TSA5055T is controlled via the 2-wire i 2 c-bus. for programming, there is one (7-bit) module address and the r/ w bit for selecting read or write mode. write mode: r/ w=0 ; see table 1 after the address transmission (first byte), data bytes can be sent to the device. four data bytes are needed to fully program the TSA5055T. the bus transceiver has an auto-increment facility that permits the programming of the TSA5055T within one single transmission (address + four data bytes). the TSA5055T can also be partly programmed on the condition that the first data byte following the address is byte 2 or byte 4. the meaning of the bits in the data bytes is given in table 1. the first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge-pump and port information (first bit = 1) will follow. until an i 2 c-bus stop condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. this allows a smooth frequency sweep for fine tuning. at power-on, the ports are set to the high-impedance state. the 7.8125 khz reference frequency is obtained by dividing the output of the 4 mhz crystal oscillator by 512. because the input of the rf signal is first divided by 16, the step size is 125 khz. a 3.2 mhz crystal can offer a step size of 100 khz.
1999 aug 11 5 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T table 1 write data format; see notes 1 to 13 notes 1. ma1 and ma0: programmable address bits (see table 3). 2. a : acknowledge bit. 3. n14 to n0: programmable divider bits. 4. n = n14 2 14 + n13 2 13 + ... + n1 2 1 + n0. 5. cp: charge-pump current. cp = 0: 50 m a; cp = 1: 220 m a. 6. p7 to p4 = 1: open-collector outputs are active. 7. p7 to p3 and p0 = 0: outputs are in high-impedance state. 8. p3 and p0 = 1: current-limited outputs are active. 9. t1, t0 and os = 0, 0 and 0: normal operation. 10. t1 = 1: p6 = f ref and p7 = f div . 11. t0 = 1: 3-state charge-pump. 12. os = 1: operational amplifier output is switched off (varicap drive disable). 13. x: dont care. byte msb data byte lsb command address 11000ma1ma00abyte1 programmable divider 0 n14 n13 n12 n11 n10 n9 n8 a byte 2 n7 n6 n5 n4 n3 n2 n1 n0 a byte 3 charge-pump and test bits 1 cp t1 t0 1 1 1 os a byte 4 output ports, control bits p7 p6 p5 p4 p3 x x p0 a byte 5 read mode: r/ w=1 ; see table 2 data can be read out of the TSA5055T by setting the r/ w bit to 1. after the slave address has been recognized, the TSA5055T generates an acknowledge signal (a) and the first data byte (status byte) is transferred to the sda line (msb first). data is valid on the sda line while the scl clock signal is high. a second data byte can be read out of the TSA5055T if the processor generates an acknowledge signal on the sda line. end of transmission will occur if the processor does not send an acknowledge signal. the TSA5055T will then release the data line to allow the processor to generate a stop condition. when ports p3 to p7 are used as inputs, they must be programmed to their high-impedance state. the por flag (power-on reset) is set to 1 at power-on and when v cc goes below 3 v. the flag is reset when an end of data is detected by the TSA5055T (end of a read sequence). control of the loop is made possible with the in-lock flag fl, which indicates when the loop is phase-locked (fl = 1).
1999 aug 11 6 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T table 2 read data format (see notes 1 to 5) notes 1. por: power-on reset flag (por = 1 on power-on). 2. fl: in-lock flag (fl = 1 when the loop is phase-locked). 3. i2, i1 and i0: digital information for i/o ports p7, p5 and p4 respectively. 4. a2, a1 and a0: digital outputs of the 5-level adc. accuracy is 1 2 lsb (see table 4). 5. msb is transmitted first. bits i2, i1 and i0 represent the status of the i/o ports p7, p5 and p4, respectively. a logic 0 indicates a low level and a logic 1 a high level (ttl levels). a built-in 5-level adc is available at i/o port p6. this adc can be used to feed afc information to the controller from the if section of the receiver, as shown in fig.4. the relationship between bits a2, a1, a0 and the input voltage at port p6 is given in table 4. table 3 address selection address selection ; see table 3 the module address contains programmable address bits (ma1 and ma0), which offer the possibility of having several synthesizers (up to three) in one system. the relationship between ma1 and ma0 and the input voltage at port p3 is given in table 3. table 4 adc levels byte msb data byte lsb command address 11000ma1ma01abyte1 status byte por fl i2 i1 i0 a2 a1 a0 - byte 2 ma1 ma0 voltage applied on port p3 0 0 0 to 0.1v cc 0 1 always valid 1 0 0.4v cc to 0.6v cc 1 1 0.9v cc to 13.5 v a2 a1 a0 voltage applied on port p6 1 0 0 0.6v cc to v cc 0 1 1 0.45v cc to 0.6v cc 0 1 0 0.3v cc to 0.45v cc 0 0 1 0.15v cc to 0.3v cc 0 0 0 0 to 0.15v cc
1999 aug 11 7 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T fig.3 symmetrical application diagram. handbook, full pagewidth fce048 TSA5055T p5 p6 p7 p4 p3 scl i 2 c-bus 4 mhz 18 pf 180 nf if signal if section afc output micro- controller p0 39 nf 22 k w satellite mixer oscillator part oscillator outputs varicap input 22 k w 1 nf 1 nf bc847b 0.1 m f v t + 33 v + 5 v + 12 v 16 12 15 14 13 11 10 9 1 5 2 3 4 6 7 8 sda
1999 aug 11 8 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T fig.4 asymmetrical application diagram. handbook, full pagewidth fce049 TSA5055T p5 p6 p7 p4 p3 scl i 2 c-bus 4 mhz 18 pf 180 nf if signal if section afc output micro- controller p0 39 nf 22 k w satellite mixer oscillator part oscillator output varicap input 22 k w 1 nf 10 nf bc847b 0.1 m f v t + 33 v + 5 v + 12 v 16 12 15 14 13 11 10 9 1 5 2 3 4 6 7 8 sda
1999 aug 11 9 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T limiting values in accordance with the absolute maximum rating system (iec 134). handling all pins withstand the esd test in accordance with mil-std-883c , category a (1000 v). thermal characteristics characteristics v cc = 5 v; t amb =25 c; unless otherwise speci?ed. symbol parameter min. max. unit v cc supply voltage - 0.3 +6 v v o(pd) charge-pump (pd) output voltage - 0.3 v cc v v i(q1) crystal (q1) input voltage - 0.3 v cc v v i/o(sda) serial data (sda) input/output voltage - 0.3 +6 v v i(scl) serial clock (scl) input voltage - 0.3 +6 v v i/o(p7-p0) input/output ports (p7 to p3 and p0) voltage - 0.3 +16 v v i(rfin) prescaler inputs (rf in1 and rf in2 ) voltage - 0.3 +2.5 v v o(ud) drive output (ud) voltage - 0.3 v cc v i o(p4-p7) output ports (p7 to p4) current (open-collector) - 1 +15 ma i o(sda) serial data (sda) output current (open-collector) - 1+5ma t stg storage temperature - 40 +150 c t j maximum junction temperature - 150 c symbol parameter conditions value unit r th(j-a) from junction to ambient in free air 110 k/w symbol parameter conditions min. typ. max. unit v cc supply voltage range 4.5 5 5.5 v t amb ambient temperature - 20 - +85 c f rf rf input frequency range 1 - 2.65 ghz n divider ratio 256 - 32767 i cc supply current - 60 80 ma f xtal crystal oscillator frequency 3.2 4 4.48 mhz z xtal crystal oscillator impedance (pin 2) absolute value 600 1000 -w v xtal(p-p) drive level on pin 2 (quartz philips 4322 143 04093) (peak-to-peak value) - 110 - mv v i(rms) input voltage level (rms value) v cc = 4.5 to 5.5 v; t amb = - 20 to +85 c; see typical sensitivity curve in fig.5 f = 1 to 1.8 ghz 50/ - 13 - 300/2.6 mv/dbm f = 1.8 to 2.65 ghz 70/ - 10 - 300/2.6 mv/dbm r i prescaler input impedance see smith chart in fig.6 - 50 -w c i input capacitance - 2 - pf
1999 aug 11 10 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T notes 1. when a port is active, the collector voltage must not exceed 6 v. 2. measured with a single open-collector active. output ports p3 and p0 (current limited) i lo leakage current v o = 13.5 v -- 10 m a i os output sink current v o = 13.5 v 0.7 1 1.5 ma output ports p7 to p4 (open collector) ; see note 1 i lo leakage current v o = 13.5 v -- 10 m a v ol output voltage low i o = 10 ma; note 2 -- 0.7 v input ports p6 and p3 i ih input current high v ih = 13.5 v -- 10 m a i il input current low v il =0v - 10 -- m a input ports p7, p5 and p4 v ih input voltage high 2.7 -- v v il input voltage low -- 0.8 v i ih input current high v ih = 13.5 v -- 10 m a i il input current low v il =0v - 10 -- m a bus inputs scl and sda v ih input voltage high 3 - 5.5 v v il input voltage low -- 1.5 v i ih input current high v ih =5v; v cc =0v -- 10 m a v ih =5v; v cc =5v -- 10 m a i il input current low v il =0v; v cc =0v - 10 -- m a v il =0v; v cc =5v - 10 -- m a output sda (open-collector) i oh leakage current v oh = 5.5 v -- 10 m a v ol output voltage i ol =3ma -- 0.4 v charge-pump output pd i oh output current high (absolute value) cp = 1 90 220 300 m a i ol output current low (absolute value) cp = 0 22 50 75 m a v o output voltage in-lock 1.5 - 2.5 v i o(leak) off-state leakage current t0 = 1 - 5 - +5 na operational ampli?er output ud (test mode: t0 = 1) v o output voltage v o(pd) =0v -- 100 mv output voltage when switched off t0 = 1; os = 1; v o(pd) =2v -- 250 mv h fe operational ampli?er current gain t0 = 1, os = 0; v o(pd) =2v i o(ud) =10 m a 2000 -- symbol parameter conditions min. typ. max. unit i oud () i opd () i o pd leak () C ---------------------------------------------- -
1999 aug 11 11 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T fig.5 typical input sensitivity curve. v cc = 5 v; t amb =25 c. handbook, halfpage 0 800 1600 3200 9 - 3 - 27 - 39 - 15 fce060 2400 - 10 dbm 2650 f (mhz) v i (dbm) guaranteed operating area fig.6 smith chart of typical input impedance. v cc = 5 v; reference value = 50 w . handbook, full pagewidth 0.2 0.5 1 2 5 10 0.2 0.5 1 2 5 10 0 + j - j fce061 1 ghz 2 ghz 2.65 ghz 0.5 1 0.2 10 5 2
1999 aug 11 12 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T flock flag definition (fl) when the fl flag is 1, the maximum frequency deviation ( d f) from stable frequency can be expressed as follows: where: k vco = oscillator slope (hz/v) i cp = charge-pump current (a) k o =4 10 6 c1 and c2 = loop filter capacitors. d f k vco k o -------------- i cp c1 c2 + c1 c2 ---------------------- ? ?? = fig.7 loop filter. handbook, halfpage c1 c2 r mga032 flock ?ag settings flock ?ag application k vco = 50 mhz/v i cp = 220 m a c1 = 180 nf c2 = 39 nf d f= 85.8 khz. parameter min. max. unit time span between actual phase lock and fl-?ag setting 1024 1152 m s time span between the loop losing lock and fl-?ag resetting 0 128 m s
1999 aug 11 13 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T equivalent input circuits fig.8 rf input amplifier. 13 14 rf in1 v ref rf in2 fce051 600 w 600 w fig.9 current amplifier. 1 16 pd ud os fce052 v cc v ref 200 w 170 w fig.10 input/output ports, pins 6 to 11. (1) this resistor is implemented only for p0 and p3. (2) these components are not implemented for p0. fce053 v cc 6-11 (1) (2) (2) (2) 4 sda 1 k w fce054 v cc fig.11 i 2 c sda.
1999 aug 11 14 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T fig.12 i 2 c scl. 5 scl 1 k w fce055 v cc fig.13 reference oscillator. 3 q2 fce056 v cc 2 q1
1999 aug 11 15 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T package outline x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot109-1 95-01-23 97-05-22 076e07s ms-012ac 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
1999 aug 11 16 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1999 aug 11 17 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, sqfp not suitable suitable hlqfp, hsqfp, hsop, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
1999 aug 11 18 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011.
1999 aug 11 19 philips semiconductors product speci?cation 2.65 ghz bidirectional i 2 c-bus controlled synthesizer TSA5055T notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 1999 67 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 printed in the netherlands 545004/25/03/pp 20 date of release: 1999 aug 11 document order number: 9397 750 05009

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